Thermal shock analysis of functionally graded materials by micromechanical model

JSME International Journal, Series A: Solid Mechanics and Material Engineering

Volumn 45, Issue 2, 2002, Pages 138-145

  Ueda, Sei ^a  

^a OSAKA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Computational mechanics; Elasticity; Functionally graded material; Micromechanical model; Thermal shock

Indexed keywords

COMPOSITE MICROMECHANICS; EXPERIMENTAL REACTORS; MATHEMATICAL MODELS; SHOCK TESTING; STRESS CONCENTRATION; SUBSTRATES; THERMODYNAMIC PROPERTIES; THERMOELASTICITY;

THERMAL SHOCK ANALYSIS;

FUNCTIONALLY GRADED MATERIALS;

FUNCTIONALLY-GRADED MATERIAL;

EID: 0036544296     PISSN: 13447912     EISSN: None     Source Type: Journal    
DOI: 10.1299/jsmea.45.138     Document Type: Article

References (16)

1. Multiple cracking in functionally graded ceramic/metal coatings
2. Thermal shock fracture mechanism of functionally gradient materials as studied by burner heating test
3. Transient thermal stress intensity factors for a crack in a semi-infinite plate of a functionally gradient material
4. Stress intensity relaxation at the tip of an edge crack in a functionally graded material subjected to a thermal shock
5. Thermal stress intensity factor for functionally gradient plate with an edge crack
6. Thermomechanical analysis of functionally graded cylinders and plates
7. Development of tungsten/copper graded composite for high-heat flux components
8. Evaluation of properties of W-Cu functional gradient materials by micromechanical model
9. Thermal-elasto-plastic analysis of W-Cu functionally graded materials subjected to a uniform heat flow by micromechanical model
10. Thermal shock of glass fiber-reinforced plastics at low temperatures
11. Surface thermal fracture of functionally graded ceramic coatings: Effect of architecture and materials