Convective-diffusive mass transfer inside complex micro-molds during electrodeposition

Journal of Microelectromechanical Systems

Volumn 11, Issue 2, 2002, Pages 118-124

  Wang, Weihua ^a   Leith, Steven D ^b   Schwartz, Daniel T ^a  

^a University of Washington   (United States)

^b HEWLETT PACKARD COMPANY   (United States)

Author keywords

Current distribution; Electroplating; LIGA; Microfabrication; Microfluidics; NiFe alloy

Indexed keywords

DIFFUSION; ELECTRIC CURRENTS; ELECTROLYTES; ELECTROPLATING; ENERGY DISPERSIVE SPECTROSCOPY; HEAT CONVECTION; MASS TRANSFER; MICROSTRUCTURE; NICKEL ALLOYS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR GROWTH;

CONVECTIVE DIFFUSIVE MASS TRANSFER; CURRENT DISTRIBUTION; GROWTH RATE; LITHOGRAPHIC MASK; MICRO MOLDS; MICROFABRICATION; MICROFLUIDICS; PARTICLE IMAGE VELOCIMETRY; PARTICLE TRACKING VELOCIMETRY; PROCESS ARCHAEOLOGY;

MICROELECTROMECHANICAL DEVICES;

EID: 0036540819     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.993446     Document Type: Article

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