Some problems in switching to lead-free solders

Soldering and Surface Mount Technology

Volumn , Issue 25, 1997, Pages 11-12

  Hampshire, W B ^a  

^a Hampshire Technical Services   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; ELECTRONICS INDUSTRY; LEAD ALLOYS; RELIABILITY; SOLDERED JOINTS; SUBSTRATES;

LEAD FREE SOLDERS;

SOLDERING ALLOYS;

EID: 0031069165     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. See Proceedings of Surface Mount International 1992, published by the SMTA, specifically' 'White Paper Assessment of the Use of Lead in Electronic Assembly', p. 1; 'The Search for Lead-Free Solders', by W. B. Hampshire, p. 729. See also many papers in more recent Nepcon Proceedings, SMI Proceedings, AIME Conference Proceedings, a workshop held at Northwestern University in July 1995, etc.
2. See Proceedings of Surface Mount International 1992, published by the SMTA, specifically' 'White Paper Assessment of the Use of Lead in Electronic Assembly', p. 1; 'The Search for Lead-Free Solders', by W. B. Hampshire, p. 729. See also many papers in more recent Nepcon Proceedings, SMI Proceedings, AIME Conference Proceedings, a workshop held at Northwestern University in July 1995, etc.
3. 'Development of Improved Solders for Electronic Reliability', Hughes Aircraft Company, Fullerton, CA, Technical Report AFML-TR-77-93, prepared for the Air Force Materials Laboratory, Wright-Patterson Air Force Base, Ohio, June (1977).
4. Private communication from ITRI, Ltd. Uxbridge, England.
5. Heiser, E. A., Moy, P. C., Munie, G. C., Machusak, D. A. and Wenger, G. M., 'Development of AT&T's Internal Solderability Standard: Building on External Specifications and Assembly Experience', Proceedings Surface Mount International 1995, San Jose, California, p. 468 (1995).