Interfacial electronic structure of thin Cu films grown on Ar+-ion sputter-cleaned α-Al2O3 substrates.

Journal of Materials Science and Technology

Volumn 18, Issue 2, 2002, Pages 117-120

  Scheu, Christina ^a   Gao, Min ^a   Rühle, Manfred ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

Al2O3; Cu film; Elecrtronic structure; Ion sputtering

Indexed keywords

ALUMINA; COPPER; ELECTRONIC STRUCTURE; ION BEAMS; SPUTTERING;

ALUMINA SUBSTRATES; COPPER THIN FILMS;

METALLIC FILMS;

EID: 0036520819     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (28)

1. Interface science and materials interconnection