RF-microwave multi-layer integrated passives using fully organic system on package(SOP) technology

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2001, Pages 1731-1734

  Davis, M F ^a   Sutono, A ^a   Lim, K ^a   Laskar, J ^a   Sundaram, V ^a   Hobbs, J ^a   White, G E ^a   Tummala, R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INSERTION LOSSES; MICROSTRIP LINES; MULTICHIP MODULES; MULTILAYERS; SLOT ANTENNAS; WAVEGUIDES;

MULTI LAYER CERAMIC TECHNOLOGY; ORGANIC SYSTEM ON PACKAGE TECHNOLOGY; PLANAR ANTENNA;

ELECTRONICS PACKAGING;

EID: 0035689081     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Analog and digital circuits using organic thin-film transistors on polyester substrates
2. Microwave and millimeter-wave packaging and interconnection methods for single and multiple chip modules
3. RF/Microwave characterization of multilayer ceramic-based MSM technology
4. Multilayer ceramic packaging alternatives
5. 60-GHz-band monolithic HEMT amplifiers using BCB thin film layers on GaAs substrates
6. Microwave multichip modules using low cost microwave chip on flex packaging technology
7. X-band Si bipolar transistor single-chip transceiver using three-dimensional MMIC technology
8. Multi-layer fully organic-based system on package(SOP) technology for RF applications
9. CPW-Fed slot antennas on multilayer dielectric substrate
10. A 60GHz imaging array using CPW-fed twn-slot on multilayered substrates
11. Use of BCB in high frequency MCM interconnects