Correlation between plasma conditions and properties of (Ti, Al)N coatings deposited by PECVD

Surface and Coatings Technology

Volumn 151, Issue 152, 2002, Pages 359-364

  Kyrylov, O ^a   Cremer, R ^a   Neuschutz D ^a   Prange, R ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

(Ti, Al)N; Nanocomposites; Plasma enhanced chemical vapor deposition (PECVD)

Indexed keywords

ALUMINUM NITRIDE; COATINGS; MICROHARDNESS; MORPHOLOGY; THIN FILMS;

CUBIC FILMS;

TITANIUM NITRIDE;

ALUMINUM NITRIDE; CHEMICAL VAPOR DEPOSITION; INORGANIC COATING; TITANIUM NITRIDE;

EID: 0036494913     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(01)01653-X     Document Type: Article

References (17)

1. xN films
2. xN films prepared by magnetron sputtering
3. Corrosion-resistant die coatings for semi-solid processing
4. Experimental determination of the metastable (Ti, Al)N phase diagram up to 700 °C