Multichip-on-flex plastic encapsulated MHDI - low cost substrateless manufacturing for microwave and millimeterwave modules

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 1996, Pages 219-222

  Cooper, Paul D ^a   Piacente, Patricia A ^a   Street, Robert J ^a  

^a LOCKHEED MARTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; MICROPROCESSOR CHIPS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES; SUBSTRATES;

CHIP ON FLEX TECHNOLOGY; MICROWAVE HIGH DENSITY INTERCONNECT (MHDI); POLYIMIDE FLEX CIRCUITS;

ELECTRONICS PACKAGING;

EID: 0029724977     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.1996.508497     Document Type: Conference Paper

References (3)

1. P. D. Cooper Microwave Multi-Chip Modules (MMCMs) 1994 IEEE MTT-S Workshop WFFC, Interconnect and Packaging Technologies and Issues 1994 IEEE MTT-S Workshop WFFC, Interconnect and Packaging Technologies and Issues San Diego CA
2. P. D. Cooper MHDI Multichip Modules for 1 to 100 GHz Applications 1995 IEEE MTT-S Workshop WMIII, Packaging Technology 1995 IEEE MTT-S Workshop WMIII, Packaging Technology Orlando FL
3. J. L. Bugeau 1995 IEEE MTT-S Packaging Technology Workshop WMHI 1995 IEEE MTT-S Packaging Technology Workshop WMHI Orlando FL