A passive humidity monitoring system for in situ remote wireless testing of micropackages

Journal of Microelectromechanical Systems

Volumn 11, Issue 1, 2002, Pages 61-67

  Harpster, Timothy J ^b   Hauvespre, Sébastien ^b   Dokmeci, Mehmet R ^a,b   Najafi, Khalil ^a,b  

^a IEEE

^b UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Anodic bonding; Hermetic; Humidity; Packaging; Passive; Wireless

Indexed keywords

ATMOSPHERIC HUMIDITY; ENVIRONMENTAL ENGINEERING; ENVIRONMENTAL TESTING; MICROSENSORS; NATURAL FREQUENCIES; REMOTE SENSING;

HUMIDITY MONITORING SYSTEM; HUMIDITY SENSOR; MICROPACKAGES; MINIATURE HERMETIC PACKAGES; REMOTE WIRELESS TESTING;

MICROELECTROMECHANICAL DEVICES;

EID: 0036475536     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.982864     Document Type: Article

References (8)

1. A hermetic glass silicon micropackage with high-density on-chip feedthroughs for sensors and actuators
2. Accelerated testing of anodically bonded glass-silicon packages in salt water
3. A high sensitivity polyimide humidity sensor for monitoring hermetic micropackages
4. Biomedical implantable systems
5. Wireless micromachined ceramic pressure sensors
6. Hermetically sealed inductor-capacitor (LC) resonator for remote pressure monitoring