메뉴 건너뛰기




Volumn 4828, Issue , 2002, Pages 69-79

High temperature automotive electronics

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; AUTOMOBILE ENGINES; AUTOMOTIVE ENGINEERING; DISTRIBUTED PARAMETER CONTROL SYSTEMS; HIGH TEMPERATURE APPLICATIONS; INTELLIGENT MATERIALS;

EID: 0036421990     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (11)

References (29)
  • 2
    • 0011269044 scopus 로고    scopus 로고
    • What's driving the growth
    • August
    • Gerry Kobe, "What's Driving the Growth," Automotive Industries, Vol. 180, No. 8, August 2000.
    • (2000) Automotive Industries , vol.180 , Issue.8
    • Kobe, G.1
  • 4
    • 0011268755 scopus 로고    scopus 로고
    • Current trends: What are the roadblocks facing mass market, high-tech electronic content?
    • July
    • Paul Hansen, "Current Trends: What are the roadblocks facing mass market, high-tech electronic content?", Automotive Industries, Vol. 181, No. 7, July 2001, pp. 26-29.
    • (2001) Automotive Industries , vol.181 , Issue.7 , pp. 26-29
    • Hansen, P.1
  • 5
    • 85072468308 scopus 로고    scopus 로고
    • Embedded electronics in electro-mechanical systems for automotive applications
    • #2001-01-0691, March 5-8
    • Bruce A. Meyers, Jeff H. Burns, and Joseph M. Ratell, "Embedded Electronics in Electro-Mechanical Systems for Automotive Applications," SAE International, Technical Paper Series, #2001-01-0691, March 5-8, 2001.
    • (2001) SAE International, Technical Paper Series
    • Meyers, B.A.1    Burns, J.H.2    Ratell, J.M.3
  • 8
    • 0011351320 scopus 로고    scopus 로고
    • The future of automotive electronics
    • Oct.
    • "The Future of Automotive Electronics," Automotive Engineering International, Oct. 2000.
    • (2000) Automotive Engineering International
  • 9
    • 0031232773 scopus 로고    scopus 로고
    • 200°C operation of a 500-W DC-DC converter utilizing power MOSFETs
    • R.M. Nelms and R. Wayne Johnson, "200°C Operation of a 500-W DC-DC Converter Utilizing Power MOSFETs," The IEEE Transactions on Industrial Applications, Vol. 33, No. 5, 1997, pp. 1267-1272.
    • (1997) The IEEE Transactions on Industrial Applications , vol.33 , Issue.5 , pp. 1267-1272
    • Nelms, R.M.1    Johnson, R.W.2
  • 12
    • 36449008541 scopus 로고
    • In site scanning electron microscope comparison studies on electromigration of Cu and CuSn alloys for advanced chip interconnects
    • K.L. Lee, C.K. Hu, and K.N. Tu, "in Site Scanning Electron Microscope Comparison Studies on Electromigration of Cu and CuSn Alloys for Advanced Chip Interconnects," Journal of Applied Physics, vol. 87, no. 7, pp. 4428-4437, 1995.
    • (1995) Journal of Applied Physics , vol.87 , Issue.7 , pp. 4428-4437
    • Lee, K.L.1    Hu, C.K.2    Tu, K.N.3
  • 13
    • 0024766460 scopus 로고
    • Temperature acceleration of time-dependent dielectric breakdown
    • November
    • Reza Moazzami, Jack C. Lee and Chenming Hu, "Temperature Acceleration of Time-Dependent Dielectric Breakdown," IEEE Transactions on Electron Devices, Vol. 36, No. 11, November 1989, pp. 2462-2465.
    • (1989) IEEE Transactions on Electron Devices , vol.36 , Issue.11 , pp. 2462-2465
    • Moazzami, R.1    Lee, J.C.2    Hu, C.3
  • 16
    • 0011265323 scopus 로고    scopus 로고
    • High-temperature storage and thermal cycling studies of heraeus-cermalloy thick film and dale power wirewound resistors
    • March
    • Jeffrey E. Nacre, R. Wayne Johnson, and Richard R. Grzybowski, "High-Temperature Storage and Thermal Cycling Studies of Heraeus-Cermalloy Thick Film and Dale Power Wirewound Resistors," accepted for publication in the March 2002 issue of the IEEE Transactions on Components and Packaging Technologies.
    • (2002) IEEE Transactions on Components and Packaging Technologies
    • Nacre, J.E.1    Johnson, R.W.2    Grzybowski, R.R.3
  • 27
    • 0003665794 scopus 로고    scopus 로고
    • National Center for Manufacturing Sciences, Final Report 0096RE01, Project 170503-96034, August
    • "Lead-free, High-temperature, Fatigue-resistant Solder, National Center for Manufacturing Sciences, Final Report 0096RE01, Project 170503-96034, August 2001.
    • (2001) Lead-free, High-temperature, Fatigue-resistant Solder
  • 28
    • 84892822881 scopus 로고    scopus 로고
    • Failure mechanisms due to current and temperature
    • Austin, TX, June
    • Peter Elenius, "Failure Mechanisms Due to Current and Temperature," IMAPS Flip Chip Workshop, Austin, TX, June 2001.
    • (2001) IMAPS Flip Chip Workshop
    • Elenius, P.1
  • 29
    • 2342448871 scopus 로고    scopus 로고
    • The reliability study of flip chip assembly with NiAu and Ag surface finishes
    • San Diego, January 19-24
    • Jiming Zhou, "The Reliability Study of Flip Chip Assembly with NiAu and Ag Surface Finishes," Proceedings of the 2002 APEX Conference, San Diego, January 19-24, 2002.
    • (2002) Proceedings of the 2002 APEX Conference
    • Zhou, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.