High temperature die-attach effects on die stresses

1998 4th International High Temperature Electronics Conference, HITEC 1998

Volumn , Issue , 1998, Pages 61-67

  Lin, Shun Tien ^a   Benoit, J T ^a   Grzybowski, R R ^a   Zou, Y ^b   Suhling, J C ^b   Jaeger, R C ^b  

^a UNITED TECHNOLOGIES RESEARCH CENTER   (United States)

^b AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CHIP SCALE PACKAGES; DIGITAL STORAGE; FAILURE (MECHANICAL); MICROCRACKS; MICROELECTRONICS; TESTING;

DIE ATTACH ADHESIVE; DIE-ATTACH MATERIALS; HIGH-TEMPERATURE DIE-ATTACH; MICROELECTRONIC PACKAGE; PIEZO-RESISTIVE SENSORS; RADIUS OF CURVATURE; RELIABLE ELECTRONICS; THREE DIMENSIONAL FINITE ELEMENT SIMULATION;

DIES;

EID: 85003824869     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HITEC.1998.678199     Document Type: Conference Paper

References (16)

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