The realization of a multi-layer band pass filter using laser direct-write techniques

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4828, Issue , 2002, Pages 23-28

  Zhang, Chengping ^a   Liu, David ^a   Kegresse, Todd ^a   Mathews, Scott A ^a   Duignan, Michael T ^a   Schaefer, Timothy M ^a   Modi, Rohit ^a   Wu, Huey Daw ^a   Chrisey, Douglas B ^a  

^a Potomac Photonics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; LASER APPLICATIONS; MICROELECTRONICS; ULTRASHORT PULSES; ULTRAVIOLET RADIATION;

LASER DIRECT-WRITE TECHNIQUES;

BANDPASS FILTERS;

EID: 0036421376     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. A. Piqué, D.B. Chrisey, R.C.Y. Auyeung, S. Lakeou, R. Chung, R.A. McGill, P.K. Wu, M.T. Duignan, J.M. Fitz-Gerald, and H.D. Wu, "Laser Direct Writing of Circuit Elements and Sensors," SPIE Proceedings, Vol. 3618, 1999, p.330.
2. A. Piqué, D.B. Chrisey, R.C.Y. Auyeung, J.M. Fitz-Gerald, H.D. Wu, R.A. McGill, S. Lakeou, P.K. Wu, V. Nguyen, and M.T. Duignan, "A Novel Laser Transfer Process for Direct Writing of Electronic and Sensor Materials," Applied Physics A, Materials Science & Processing 69 (1999), S279.
3. Scott A. Mathews, Michael T. Duignan, David N. Wells, Paolina Atanassova, and Toivo Kodas, "An Integrated Tool for Fabrication of Electronic Components by Laser Direct-Write," Proceedings for the International Conference on High-Density Interconnect and Systems Packaging (HDI), Santa Clara, CA, April 18-20, 2001.
4. Scott A. Mathews, Chengping Zhang, Todd Kegresse and David Liu, "Integrated tool for fabrication of electronic components by laser direct-write," SPIE Proceedings Vol. 4637, Laser Applications in Microelectronic and Optoelectronic Manufacturing, LASE 2002, January 2002.
5. http://www.mesofab.com.
6. Randall W. Rhea, "HF Filter Design and Computer Simulation," Nobel Publishing, Atlanta, GA, 1994.
7. D. Dimos, B.H. King, P. Yang, "Direct-Write Fabrication of Integrated, Multi-layer Passive Components," International Symposium on Advanced Packaging Materials, 1999.
8. Donald C. Benson, Yongnan Xuan, Jiamin He, Chang-Ming Lin, Charles R. Hodges, Elizabeth A. Logan, Timothy M. Schaefer and Barry K. Gilbert, "Integrated Passive Components for RF Applications," 1997 Wireless Communications Conference.