SCOPUS 정보 검색 플랫폼

Journal of Adhesion Science and Technology

Volumn 16, Issue 11, 2002, Pages 1501-1507

Adhesion of electroless nickel plating on polished silicon

(3) Karmalkar, S a Marjorie, Roji a Sumithra, V G a

a INDIAN INSTITUTE OF TECHNOLOGY MADRAS (India)

Author keywords

Activation; Adhesion; Electroless nickel; Polished silicon

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); COMPOSITION; DOPING (ADDITIVES); ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; POLISHING; SEMICONDUCTING SILICON; SUBSTRATES; CHEMICAL ACTIVATION; ELECTROPLATING; NICKEL PLATING; SEMICONDUCTOR DOPING;

ACTIVATOR; ADHESION STRENGTH; PLATING BATH TEMPERATURE;

NICKEL; ADHESION;

ACTIVATION STEPS; ELECTROLESS NICKEL; ELECTROLESS NICKEL PLATING; PLATING BATH TEMPERATURE; SILICON DOPING; SUBSTRATE RESISTIVITY;

EID: 0036335671 PISSN: 01694243 EISSN: None Source Type: Journal
DOI: 10.1163/156856102320252921 Document Type: Article

Times cited : (10)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.