Cell surface-engineered yeast with ability to bind, and self-aggregate in response to, copper ion

Applied Microbiology and Biotechnology

Volumn 59, Issue 2-3, 2002, Pages 259-264

  Kuroda, K ^a   Ueda, M ^a   Shibasaki, S ^a   Tanaka, A ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ION; HEAVY METAL; HEXAPEPTIDE; HISTIDINE; METAL ION; METALLOTHIONEIN; TRANSCRIPTION FACTOR; ZINC FINGER PROTEIN;

BIOREMEDIATION; BIOTECHNOLOGY; COPPER; YEAST;

ADSORPTION; ARTICLE; CELL AGGREGATION; CELL FUNCTION; CELL SURFACE; CELL TRANSFORMATION; CHELATION; CHEMICAL BOND; CONTROLLED STUDY; FUNGAL GENE; FUNGAL STRAIN; FUSION GENE; GENE CONSTRUCT; GENE CONTROL; GENE EXPRESSION; GENE INDUCTION; GENETIC CODE; GENETIC ENGINEERING; NONHUMAN; PLASMID; POLLUTANT; PRODUCT RECOVERY; PROMOTER REGION; SACCHAROMYCES CEREVISIAE; YEAST CELL;

ADSORPTION; COPPER; GENETIC ENGINEERING; HYDROGEN-ION CONCENTRATION; SACCHAROMYCES CEREVISIAE;

SACCHAROMYCES; SACCHAROMYCES CEREVISIAE;

EID: 0036314857     PISSN: 01757598     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00253-002-1014-8     Document Type: Article

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