Cell surface-engineered yeast displaying a histidine oligopeptide (hexa-His) has enhanced adsorption of and tolerance to heavy metal ions

Applied Microbiology and Biotechnology

Volumn 57, Issue 5-6, 2001, Pages 697-701

  Kuroda, K ^a   Shibasaki, S ^a   Ueda, M ^a   Tanaka, A ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLUTININ; COPPER ION; EDETIC ACID; GLYCOSYLPHOSPHATIDYLINOSITOL; HISTIDINE; METAL ION; OLIGOPEPTIDE; SIGNAL PEPTIDE;

YEAST;

ADSORPTION; ARTICLE; CARBOXY TERMINAL SEQUENCE; CELL SURFACE; CELL WALL; CHELATION; CONTROLLED STUDY; GENE FUSION; GENETIC CODE; NONHUMAN; PH; SACCHAROMYCES CEREVISIAE; STRAIN DIFFERENCE; YEAST CELL;

ADSORPTION; ARTIFICIAL GENE FUSION; CELL MEMBRANE; CHELATING AGENTS; COPPER; GENETIC ENGINEERING; GENETIC VECTORS; METALS, HEAVY; OLIGOPEPTIDES; PEPTIDES; PLASMIDS; PROTEIN SORTING SIGNALS; RECOMBINANT FUSION PROTEINS; SACCHAROMYCES CEREVISIAE; TRANSFORMATION, GENETIC;

SACCHAROMYCES; SACCHAROMYCES CEREVISIAE;

EID: 0035668045     PISSN: 01757598     EISSN: None     Source Type: Journal    
DOI: 10.1007/s002530100813     Document Type: Article

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