Optimizing the package design with electrical modeling and simulation

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 111-117

  Qi, Quan ^a   Quint, Dave ^a   Frank, Mark ^a   Michalka, Tim ^a   Bois, Karl ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED SOFTWARE ENGINEERING; COMPUTER SIMULATION; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRIC PROPERTIES; PRINTED CIRCUIT BOARDS; PRODUCT DESIGN;

CAPACITOR PLACEMENT; ELECTRICAL MODELING; PACKAGE DESIGN; ROUTING; SIGNAL INTEGRITY;

ELECTRONICS PACKAGING;

EID: 0034822058     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927703     Document Type: Article

References (8)

1. Circuits
2. Skin effects models for transmission line structures using generic SPICE circuit simulators
3. Modeling the power rails in leading edge microprocessor packages
4. Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer system