High performance Mobile Pentium® III package development and design

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 378-385

  Hasan, Altaf ^a   Sarangi, Ananda ^a   Sathe, Ajit ^a   Ji, Gang ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; COMPUTER SIMULATION; FLIP CHIP DEVICES; INDUCTANCE; MICROPROCESSOR CHIPS; POWER SUPPLY CIRCUITS;

MOBILE PROCESSOR PACKAGING;

CHIP SCALE PACKAGES;

EID: 0036296685     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. High performance package designs for a 1 GHz microprocessor
2. Flip chip technology on Pin Grid Array packages
3. Reliability and performance tradeoff in the design of on-chip power delivery and interconnects
4. Design and performance evaluation of Pentium® III microprocessor packaging