High density substrate for semiconductor packages using newly developed low CTE build-up materials

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 216-220

  Takahashi, Atsushi ^a   Kobayashi, Kazuhito ^a   Arike, Shigeharu ^a   Okano, Norio ^a   Nakayama, Hajime ^a   Wakabayashi, Akihiko ^a   Suzuki, Takayuki ^a  

^a High Performance Materials Department   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SUBSTRATES; THERMAL EXPANSION;

THERMAL EXPANSION COEFFICIENT;

ELECTRONICS PACKAGING;

EID: 0033684672     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)