Micro/chip scale packages and the semiconductor industry road map

2nd 1998 IEMT/IMC Symposium

Volumn 1998-April, Issue , 1998, Pages 302-305

  Bauer, C E ^a  

^a Techlead Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUITS; MICROELECTRONICS; MINIATURE INSTRUMENTS; PACKAGING MATERIALS; SEMICONDUCTOR DEVICE MANUFACTURE;

DESIGN AND ASSEMBLIES; MATERIALS AND PROCESS; PACKAGING TECHNOLOGIES; SEMICONDUCTOR INDUSTRY; SEMICONDUCTOR INDUSTRY ASSOCIATIONS; SEMICONDUCTOR TECHNOLOGY; TECHNOLOGICAL CONVERGENCE; TECHNOLOGY INTEGRATION;

INTEGRATED CIRCUIT DESIGN;

EID: 2142845107     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMTIM.1998.704664     Document Type: Conference Paper

References (7)

1. The Nationa1 Technology Road Map for Semiconductors, 1997 Edition, Semiconductor Industry Association.
2. "The SIA's 1997 National Technology Roadmap for Semiconducit~rs, ~P'. Gargini, J. Glaze & 0. Williarns, Solid State Technology, January 1998.
3. "Then ;and Now; Comparing the 1994 and 1997 road map Channel Magazine, January 1998.
4. "Concurrent Engineering into the Next Millenium; The Impacts of CSP Components, " D. E. Lee & J. L. Johns, Proceedings of the Pan Pacific Microelectrclnics Symposium, 1998.
5. IPC Technology Road Map for Electronic Initerconnections, IPC, 1997.
6. "Roadmap Identifies Packaging Requirements and challenge, J. Baliga, Semiconductor International, January 1998, pp. 44.
7. "Integration Versus Convergence, " C. E. Bauer, Advanced Packaging, May 1998.