Characterization study of lead-free Sn-Cu plated packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1238-1245

  Lee, Jeffrey Chang Bing ^a   Yao, Yung Ling ^a   Chiang, Fang Yi ^a   Zheng, P J ^a   Liao, C C ^a   Chou, Y S ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Lead free plating; Solder joint reliability; Solderability; Whisker growth

Indexed keywords

SOLDER PASTES; WHISKER GROWTH;

ALLOYING; ELECTROLYTES; GRAIN GROWTH; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SUBSTRATES; WETTING;

ELECTRONICS PACKAGING;

EID: 0036287617     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008265     Document Type: Conference Paper

References (9)

1. Grain size effect of electro-plated tin coating on whisker growth
2. Spontaneous growth of tin whisker
3. Characterization of mechanical properties of bulk lead free solders
4. Effect of thermal aging on the shear strength of lead free solder joint
5. Mechanical cyclic fatique of lead-free interconnects of a flex-tpye BGA
6. Microstructure coursening of lead-free solder joints during thermal cycling