Method of fatigue life prediction for surface-mount solder joints of electronic devices by mechanical fatigue test

American Society of Mechanical Engineers, EEP

Volumn 4-1, Issue , 1993, Pages 493-498

  Uegai, Yasumi ^a   Tani, Shuichi ^a   Inoue, Akio ^a   Yoshioka, Sumio ^a   Tamura, Keiichl ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE TESTING; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

ELASTOPLASTIC STRAIN RANGE; ELECTRONIC DEVICES; FATIGUE LIFE PREDICTION;

ELECTRONIC EQUIPMENT;

EID: 0027746688     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)