Modification of poly(tetrafluoroethylene) and copper foil surfaces by graft polymerization for adhesion improvement

International Journal of Adhesion and Adhesives

Volumn 20, Issue 6, 2000, Pages 467-476

  Wu, J Z ^a   Kang, E T ^a   Neoh, K G ^a   Cui, C Q ^b   Lim, T B ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; CROSSLINKING; EPOXY RESINS; METAL FOIL; MONOMERS; PLASMAS; POLYACRYLATES; POLYMERIZATION; POLYTETRAFLUOROETHYLENES; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

GRAFT POLYMERIZATION;

PLASTIC FILMS;

EID: 0033666114     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-7496(00)00018-X     Document Type: Article

References (30)

1. Doane DA, Franzon PD. editors. Multichip module technologies and alternatives, the basics, Part B. New York: van Nostrand Reinhold, 1993.
2. Scheirs J, editor. Modern fluoropolymers. Chichester: Wiley, 1997.
3. Kroschwitz JI, editor. Encyclopedia of polymer science and engineering. New York: Wiley, 1989.
4. Celerier A., Machet J. Thin Solid Films. 148:1987;323.
5. Mathieson I., Brewis D.M., Sutherland I., Cayless R.A. J Adhesion. 46:1994;49.
6. Rye R., Arnold G.W., Ricco A.J. J Electrochem Soc. 140:1993;3233.
7. Kang E.T., Neoh K.G., Chen W., Tan K.L., Liaw D.J., Huang C.C. J Adhesion Sci Technol. 10:1996;725.
8. Wang T., Kang E.T., Neoh K.G., Tan K.L., Cui C.Q., Lim T.B. J Adhesion Sci Technol. 11:1997;679.
9. Wu S.Y., Kang E.T., Neoh K.G., Han H.S., Tan K.L. Macromolecules. 32:1999;186.
10. Inagaki N., Tasaka S., Kawai H. J Adhesion Sci Technol. 3:1989;637.
11. Strobel M, Lyons CS, Mittal KL, editors. Plasma surface modification of polymers: relevance to adhesion. Utrecht, The Netherlands: VSP, 1994.
12. Shi M.K., Martinu L., Sacher E., Selmani A., Wertheimer M.R., Yelon A. Surf Interface Anal. 23:1995;99.
13. Kinbara A., Kikuchi A., Baba S., Abe T. J Adhesion Sci Technol. 7:1993;457.
14. Kang E.T., Tan K.L., Kato K., Uyama Y., Ikada Y. Macromolecules. 29:1996;6872.
15. Uchida E., Uyama Y., Ikada Y. J Appl Polym Sci. 47:1993;417.
16. Inagaki N., Tasaka S., Kawai H. J Adhesion Sci Technol. 3:1989;637.
17. Plueddenmann EP, editor. Silane coupling agents. New York: Plenum Press, 1991.
18. Mintova S., Valtchev V., Engstrom V., Schoeman B.J., Sterte J. Micro Mater. 11:1997;149.
19. Yongsik Jang, Kyoon Kim Eui J Appl Polym Sci. 71:1999;585.
20. Ingall M.D.K., Honeyman C.H., Mercure J.V., Bianconi P.A., Kunz R.R. J Am Chem Soc. 121:1999;3607.
21. Okumoto S., Fujita N. J Phys Chem. 102:1998;3991.
22. Song S.M., Park C.E., Yun H.K., Oh S.Y., Park J.M. J Adhesion Sci Technol. 11:1997;797.
23. Jang Jyongsik, Jang Inkoon, Kim Hyuncheol J Adhesion Sci Technol. 12:1998;323.
24. Suzuki M., Iwata A., Ikada Y. Macromolecules. 19:1986;1804.
25. Tan K.L., Woon L.L., Wong H.K., Kang E.T., Neoh K.G. Macromolecules. 26:1993;2832.
26. Richer J., Stolberg L., Lipkoski J. Langmuir. 21:1986;630.
27. Arkes B. Chem Tech. 12:1977;765.
28. Liu Y.X., Kang E.T., Neoh K.G., Tan K.L. J Polym Sci Part A: Polym Chem. 38:2000;80.
29. Zhang J.F., Cui C.Q., Lim T.B., Kang E.T., Neoh K.G. J Adhesion Sci Technol. 12:1998;1205.
30. Good R.J. J Am Chem Soc. 74:1952;5041.