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Journal of the Electrochemical Society

Volumn 149, Issue 1, 2002, Pages

Metallorganic chemical vapor deposited TiN barrier enhancement with SiH4 treatment

(4) Marcadal, Christophe a Eizenberg, Moshe b Yoon, Alex a Chen, Ling a

a APPLIED MATERIALS INC (United States)

b TECHNION ISRAEL INSTITUTE OF TECHNOLOGY (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

METALLIZING; METALLORGANIC CHEMICAL VAPOR DEPOSITION; MICROSTRUCTURE; PHYSICAL VAPOR DEPOSITION; PLASMA APPLICATIONS; PYROLYSIS; SECONDARY ION MASS SPECTROMETRY; SILICON COMPOUNDS; TERNARY SYSTEMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

DIRECT LIQUID INJECTORS (DLI);

TITANIUM NITRIDE;

EID: 0036228768 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1425792 Document Type: Article

Times cited : (21)

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