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Volumn 12, Issue 1, 2002, Pages
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High-speed grinding using thin abrasive disks for microcomponents
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINA;
DISKS (MACHINE COMPONENTS);
MACHINE DESIGN;
SHAFTS (MACHINE COMPONENTS);
SILICON WAFERS;
SPEED;
SURFACE STRUCTURE;
TURNING;
DICING TECHNOLOGY;
HIGH-SPEED GRINDING DEVICE;
MICROCOMPONENTS;
THIN ABRASIVE DISK;
ULTRAPRECISION DIAMOND TURNING MACHINE TOOL;
GRINDING (MACHINING);
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EID: 0036150625
PISSN: 09601317
EISSN: None
Source Type: Journal
DOI: 10.1088/0960-1317/12/1/401 Document Type: Article |
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Times cited : (3)
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References (8)
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