Mechanical characterization of sub-micrometer thick DLC films by AFM tensile testing for surface modification in MEMS

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2002, Pages 431-434

  Isono, Yoshitada ^a   Namazu, Takahiro ^a   Terayama, Nobuyuki ^b   Tanaka, Takeshi ^a  

^a RITSUMEIKAN UNIVERSITY   (Japan)

^b Shinko Seiki Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; FRACTURE TOUGHNESS; FRICTION; MICROELECTROMECHANICAL DEVICES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POISSON RATIO; SILICON WAFERS; SINGLE CRYSTALS; SURFACE TREATMENT; TENSILE TESTING; THICKNESS MEASUREMENT; WEAR OF MATERIALS;

LINEAR VARIABLE DISPLACEMENT TRANSDUCER; PENNING IONIZATION GAUGE; SINGLE CRYSTAL SILICON;

DIAMOND LIKE CARBON FILMS;

EID: 0036118065     PISSN: 10846999     EISSN: None     Source Type: Journal    
DOI: 10.1109/MEMSYS.2002.984295     Document Type: Article

References (4)

1. Surface engineering and micro-tribology for micro electromechanical systems
2. A new technique for measuring the mechanical properties of thin films
3. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments
4. Microscale material testing: Etching effect on the tensile strength