Utilization of polymer thick film (PTF) and flex technologies for low cost power electronics packaging of DC/DC down converters

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 625-630

  Lostetter, A B ^a   White, J ^a   Barlow, F ^a   Elshabini, A ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; COST EFFECTIVENESS; EFFICIENCY; ELECTRIC CONVERTERS; INTEGRATED CIRCUIT LAYOUT; POLYMERS; PRINTED CIRCUIT BOARDS; SUBSTRATES; THICK FILMS; THREE DIMENSIONAL;

BARE DICE; DIRECT CURRENT DOWN CONVERTERS; FLEX TECHNOLOGIES; INTEGRATED POWER MODULES; POLYMER THICK FILMS; POWER ELECTRONICS PACKAGING;

ELECTRONICS PACKAGING;

EID: 0033344353     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)