C-band oscillator using high-Q inductors embedded in multi-layer organic packaging

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2002, Pages 703-706

  Yoon, S W ^a   Davis, M F ^a   Lim, K ^a   Pinel, S ^a   Maeng, M ^a   Lee, C H ^b   Chakraborty, S ^a   Mekela, S ^a   Laskar, J ^a   White, G ^a   Tummala, R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b RF Solutions Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INDUCTORS; INTEGRATED CIRCUITS; MESFET DEVICES; OPTIMIZATION; SEMICONDUCTING GALLIUM ARSENIDE; SPURIOUS SIGNAL NOISE;

EMBEDDED INDUCTORS; MULTILAYER ORGANIC PACKAGING; OSCILLATION FREQUENCY; OSCILLATOR CIRCUITS; WIRE BOND INDUCTORS;

OSCILLATORS (ELECTRONIC);

EID: 0036063576     PISSN: 0149645X     EISSN: None     Source Type: Journal    
DOI: 10.1109/MWSYM.2002.1011720     Document Type: Article

References (8)

1. RF/microwave characterization of multilayer ceramic-based MCM technology
2. Integrated RF function architectures in fully-organic SOP technology
3. High-Q integrated spiral inductors for high performance wireless front-end systems
4. Realization of a DECT VCO circuit with MCM-D technology
5. Small size, low power consumption, low phase noise MMIC VCO using off-chip packaging resonator for mobile communication
6. Chip-package co-design of a 4.7 GHz VCO
7. 5-6 GHz-band GaAs MESFET-based cross-coupled differential oscillator MMICs with low phase-noise performance