Reflow process stabilization by chemical characteristics and process conditions

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4690 II, Issue , 2002, Pages 761-772

  Kim, Myoung Soo ^a   Park, Jeong Hyun ^a   Kim, Hak Joon ^a   Kim, Il Hyung ^a   Jeon, Jae Ha ^a   Gil, Myung Goon ^a   Kim, Bong Ho ^a  

^a Hynix Semiconductor Inc   (South Korea)

Author keywords

CD Uniformity; Contact Hole Shrinkage; Multi Step Baking; Reflow Process; Symmetric Profile

Indexed keywords

COATINGS; COMPOSITION; CROSSLINKING; ETCHING; MOLECULAR WEIGHT; OPTIMIZATION; RESINS; SHRINKAGE; SOLVENTS;

THERMAL REFLOW;

PHOTORESISTS;

EID: 0036029703     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.474277     Document Type: Conference Paper

References (4)

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