Development of resists for thermal flow process applicable to mass production

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4345, Issue I, 2001, Pages 222-231

  Kang, Y ^a   Woo, S G ^a   Choi, S J ^a   Moon, J T ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Contact hole; Flow rate; Photoresist; Thermal flow process

Indexed keywords

CROSSLINKING; DEFORMATION; FLOW PATTERNS; MOLECULAR WEIGHT; POLYSTYRENES; THERMAL EFFECTS;

THERMAL FLOW PROCESSES;

PHOTORESISTS;

EID: 0034772367     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.436851     Document Type: Conference Paper

References (5)