Impact of the colloidal silica particle size on physical vapor deposition tungsten removal rate and surface roughness

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 20, Issue 4, 2002, Pages 1556-1560

  Bouvet, D ^a   Beaud, P ^a   Fazan, P ^a   Sanjines, R ^a   Jacquinot, E ^b  

^a EPFL   (Switzerland)

^b SÜD CHEMIE AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; COLLOIDS; GROWTH (MATERIALS); INDENTATION; PARTICLE SIZE ANALYSIS; PASSIVATION; PHYSICAL VAPOR DEPOSITION; REMOVAL; SLURRIES; SURFACE ROUGHNESS; TUNGSTEN;

ALUMINA-BASED SLURRIES; SCRATCHING; SURFACE CONTACT TYPE MECHANISM; SURFACE QUALITY; TUNGSTEN REMOVAL RATE;

SILICA;

EID: 0035982587     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1490393     Document Type: Conference Paper

References (10)