Effect of humidity and temperature on the tensile strength of polyimide/silicon nitride interface and its implications for electronic device reliability

Materials Science and Engineering: A

Volumn 317, Issue 1-2, 2001, Pages 249-256

  Gupta, Vijay ^a   Hernandez, Robert ^a   Charconnet, Phillipe ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Electronic devices; Experiment; Interface strength; Laser spallation; Packages; Reliability; Silicon nitride polyimide interface

Indexed keywords

ATMOSPHERIC HUMIDITY; COMPUTER SIMULATION; INTERFACES (MATERIALS); MULTILAYERS; SILICON NITRIDE; STRESS CONCENTRATION; TENSILE STRENGTH; THERMAL EFFECTS;

DEVICE FABRICATIONS;

POLYIMIDES;

ELECTRONIC EQUIPMENT; HUMIDITY; INTERFACE; POLYIMIDE; RELIABILITY; SILICON NITRIDE; TEMPERATURE EFFECT; TENSILE STRENGTH;

EID: 0035980515     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(01)01164-9     Document Type: Article

References (11)