A method of locating dried residue on a semiconductor wafer in vapor phase decomposition-total-reflection X-ray fluorescence spectrometry by monitoring scattered X-rays

Spectrochimica Acta - Part B Atomic Spectroscopy

Volumn 56, Issue 11, 2001, Pages 2293-2300

  Mori, Yoshihiro ^a   Uemura, Kenichi ^a   Yamagami, Motoyuki ^b   Yamada, Takashi ^b  

^a NIPPON STEEL CORPORATION   (Japan)

^b Rigaku Industrial Corporation   (Japan)

Author keywords

Dried residue search; Internal standard reference; Silicon wafer; Total reflection X ray fluorescence (TXRF); Vapor phase decomposition (VPD)

Indexed keywords

CONTAMINATION; DECOMPOSITION; FLUORESCENCE; LIGHT REFLECTION; SPECTROMETRY; TRACE ELEMENTS; X RAY ANALYSIS; X RAY SCATTERING;

VAPOR PHASE DECOMPOSITION (VPD);

SILICON WAFERS;

EID: 0035976307     PISSN: 05848547     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0584-8547(01)00298-1     Document Type: Article

References (13)

1. Novel methods of TXRF analysis for silicon wafer surface inspection
2. Sub-ppm monitoring of transition metal contamination on silicon wafer surfaces by VPD-TXRF
3. Enhanced analysis of particles and vapor phase decomposition droplets by total-reflection X-ray fluorescence
4. Improvement of total reflection X-Ray fluorescence (TXRF) spectrochemical analysis for silicon wafers
5. VPD/TXRF analysis of trace elements on a silicon wafer
6. Low Z total reflection X-ray fluorescence analysis - Challenges and answers
7. WSPS: Wafer Surface Preparation System. A novel method capable of the ultratrace analytical inspection of 300 mm silicon wafer surfaces
8. Total-reflection X-ray fluorescence associated with chemical concentration and its accuracy
9. Main peak profiles of total reflection X-ray fluorescence analysis of Si(100) wafers excited by monochromatic X-ray beam W-Lβ(I)
10. Main peak profiles of total reflection X-ray fluorescence analysis of Si(100) wafers excited by monochromatic X-ray beam W-Lβ(II)