CsBi4Te6: A high-performance thermoelectric material for low- temperature applications

Science

Volumn 287, Issue 5455, 2000, Pages 1024-1027

  Chung, Duck Young ^a   Hogan, Tim ^a   Brazis, Paul ^b   Rocci Lane, Melissa ^b   Kannewurf, Carl ^b   Bastea, Marina ^c   Uher, Ctirad ^c   Kanatzidis, Mercouri G ^a  

^a MICHIGAN STATE UNIVERSITY   (United States)

^b Northwestern University   (United States)

^c UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT PUMP SYSTEMS; LOW TEMPERATURE EFFECTS; SYNTHESIS (CHEMICAL); THERMOANALYSIS; THERMOELECTRICITY;

THERMOELECTRIC MATERIALS;

CESIUM COMPOUNDS;

BISMUTH; CESIUM; TELLURIUM;

ARTICLE; COOLING; ELECTRIC CONDUCTIVITY; ELECTRONICS; HEAT; LOW TEMPERATURE; PRIORITY JOURNAL; SYNTHESIS; THERMAL CONDUCTIVITY;

EID: 0034635446     PISSN: 00368075     EISSN: None     Source Type: Journal    
DOI: 10.1126/science.287.5455.1024     Document Type: Article

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30. eq) are as follows: Bi(1), 1362(1), 0, 7502(1), 17(1); Bi(2), 2124(1), 5000, -888(1), 18(1); Bi(3), 1628(1), 0, 921(1), 18(1); Bi(4), 886(1), 5000, -627(1), 18(1); Bi(5), 2353(1), 5000, -7410(1), 17(1); Bi(6), 1146(1), 5000, 2782(1), 17(1); Bi(7), 150(1), 0, 7878(1), 18(1); Bi(8), 396(1), 0, 1365(1), 18(1); Cs(1), 543(1), 0, 5090(1), 26(1); Cs(2), 3130(1), 0, -5163(1), 28(1); Te(1), 1533(1), 5000, -722(1), 14(1); Te(2), 800(1), 0, 7845(1), 16(1); Te(3), 1226(1), 5000, 6089(1), 18(1); Te(4), 2020(1), 0, 7561(1), 16(1); Te(5), 2250(1), 0, 766(1), 14(1); Te(6), 1043(1), 0, 1003(1), 15(1); Te(7), 1757(1), 5000, -7570(1), 16(1); Te(8), 1236(1), 0, 4213(1), 18(1); Te(9), 2396(1), 0, -5982(1), 18(1); Te(10), 575(1), 5000, 2811(1), 18(1);Te(11), -76(1), 5000, 3592(1), 19(1); Te(12), 322(1), 5000, -383(1), 17(1).
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43. Supported by Office of Naval Research grant N00014-98-1-0443. The work made use of the SEM facilities of the Center for Electron Optics at Michigan State University. The work at Northwestern made use of the Central Facilities supported by NSF through the Materials Research Center (grant DMR-9632472). We thank S. D. Mahanti for fruitful discussions.