SCOPUS 정보 검색 플랫폼

Thin Solid Films

Volumn 396, Issue 1-2, 2001, Pages 205-209

Thermal stability of Cu/TiN and Cu/Ti/TiN metallizations on silicon

(2) Chen, J S a Lu, K Y a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

Electrical properties and measurements; Interfaces; Metallization; Titanium nitride

Indexed keywords

ANNEALING; CURRENT DENSITY; INTERFACES (MATERIALS); LEAKAGE CURRENTS; SEMICONDUCTOR DIODES; SILICON; THERMODYNAMIC STABILITY; TITANIUM NITRIDE; X RAY DIFFRACTION ANALYSIS;

SHEET RESISTANCE;

METALLIZING;

EID: 0035928986 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/s0040-6090(01)01186-5 Document Type: Article

Times cited : (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.