Planarization of the YBa2Cu3O7-x base electrodes in trilayer Josephson junctions

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 40, Issue 9 A/B, 2001, Pages

  Maruyama, M ^a   Furutani, T ^a   Yoshinaga, Y ^a   Kito, T ^a   Matsuda, G ^a   Akaike, H ^a   Inoue, M ^a   Fujimaki, A ^a   Hayakawa, H ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

Cleaning; CMP; Ion etching; Josephson junction; Planarization; Trilayer junction; YBCO film

Indexed keywords

CHEMICAL MECHANICAL POLISHING; ELECTRODES; SEMICONDUCTING FILMS; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACE CLEANING; SURFACE ROUGHNESS; YTTRIUM BARIUM COPPER OXIDES;

ION ETCHING; PLANARIZATION; TRILAYER JOSEPHSON JUNCTION;

JOSEPHSON JUNCTION DEVICES;

EID: 0035885682     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.40.l932     Document Type: Letter

References (10)