Investigation of MoSi etch processes for embedded attenuating phase shift mask applications utilizing a next generation ICP source

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4562 II, Issue , 2001, Pages 694-703

  Plumhoff, Jason ^a   Constantine, C ^a   Strawn, C ^a   Shin, J ^a  

^a Unaxis USA Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC WAVE ATTENUATION; EMBEDDED SYSTEMS; ETCHING; INDUCTIVELY COUPLED PLASMA; MOLYBDENUM COMPOUNDS; PHASE SHIFT; PHOTOLITHOGRAPHY; ULTRAVIOLET RADIATION;

EMBEDDED ATTENUATING PHASE SHIFT MASKS (EAPSM);

MASKS;

EID: 0035767885     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.458282     Document Type: Conference Paper

References (2)

1. C. Constantine, et al, Plasma Etch of Binary Cr masks: CD Uniformity Study of Photomasks Utilizing Varying Cr Loads: III, SPIE Proc, 4186, 85 (2000).
2. C. Constantine, et al, Inductively Coupled Plasma Etch of DUV MoSi Photomasks: A Designed Study of Etch Chemistries and Process Results, SPIE Proc, 3546, 88 (1998).