Effects of nano-scale colloidal abrasive particle size on SiO2 by chemical mechanical polishing

Materials Research Society Symposium - Proceedings

Volumn 671, Issue , 2001, Pages

  Zhou, Chunhong ^a   Shan, Lei ^a   Ng, S H ^a   Hight, Robert ^a   Paszkowski, Andrew J ^a   Danyluk, S ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; CHEMICAL MECHANICAL POLISHING; COLLOIDS; COMPOSITION EFFECTS; PARTICLE SIZE ANALYSIS; PH EFFECTS; SEMICONDUCTOR GROWTH; SILICON WAFERS; SLURRIES; SURFACE ROUGHNESS;

ABRASIVE SIZES; MATERIAL REMOVAL RATE; NANO FILM MODEL;

SILICA;

EID: 0035743475     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-671-m1.6     Document Type: Conference Paper

References (14)