Full-wave analysis of RF SAW filter packaging

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 2001, Pages 81-84

  Finch, C ^a   Yang, X ^a   Wu, T ^a   Abbott, B ^a  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; ELECTRIC WIRE; ELECTRONICS PACKAGING; INDUCTANCE;

ELECTROMAGNETIC SIMULATOR; HIGH FREQUENCY STRUCTURE SIMULATOR;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 0035729095     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. An FDTD-Touchstone hybrid technique for equivalent circuit modeling of SOP electronic packages
2. Development of low-loss band-pass filters using SAW resonators for portable telephones
3. Effects of package parasitics on the performance of SAW filters
4. Electromagnetic modeling of package parasitics in SAW-Duplexer
5. A novel approach to 3-D modeling of packaged RF power transistors
6. Modeling of parasitic effects for flip-chip SAW filters