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Volumn , Issue , 2001, Pages 458-461

An electro-thermal model of thermoelectric modules in heat pump and cooling mode (CHIM model)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING SYSTEMS; ELECTRIC CURRENTS; HEAT EXCHANGERS; HEAT PUMP SYSTEMS; HEAT RESISTANCE; MATHEMATICAL MODELS; SEMICONDUCTOR JUNCTIONS; TEMPERATURE;

EID: 0035709001     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (12)

References (9)
  • 6
    • 0031341792 scopus 로고    scopus 로고
    • Implementation and validation of a new thermal model for analysis, design and characterisation of multichip power electronics devices
    • IEEE Industry application society, Annual meeting, New Orleans, Louisiana, October
    • (1997) , pp. 1253-1258
    • Profumo, E.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.