Implementation and validation of a new thermal model for analysis, design and characterization of multichip power electronics devices

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn 2, Issue , 1997, Pages 1253-1258

  Profumo, F ^a   Facelli, S ^a   Tenconi, A ^a   Passerini, B ^a  

^a UNIVERSITY OF BOLOGNA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; POWER ELECTRONICS;

MULTICHIP POWER ELECTRONIC DEVICES;

MULTICHIP MODULES;

EID: 0031341792     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)