Temperature and time dependent finite-element model of a thermoelectric couple

International Conference on Thermoelectrics, ICT, Proceedings

Volumn , Issue , 1996, Pages 227-233

  Lau, Paul G ^a   Buist, Richard J ^a  

^a TE Technology Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING; ELECTRIC CURRENTS; ELECTRIC RESISTANCE; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SPECIFIC HEAT OF SOLIDS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EFFECTS;

SEEBECK COEFFICIENT; THERMOELECTRIC COUPLE;

THERMOCOUPLES;

EID: 0029727759     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)