Millimeter wave package design: A comparison of simulation and measurement results

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2001, Pages 29-34

  Shan, Lei ^a   Meghelli, Mounir ^a   Kim, Joong Ho ^a   Trewhella, Jean ^a   Taubenblatt, Marc ^a   Oprysko, Modest ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COAXIAL CABLES; COMPUTER SIMULATION; ELECTRIC NETWORK ANALYZERS; EQUIVALENT CIRCUITS; INDUCTANCE; MATRIX ALGEBRA; METHOD OF MOMENTS; MILLIMETER WAVES; SIGNAL PROCESSING; SUBSTRATES; THREE DIMENSIONAL;

DIGITAL WAVEFORM; HIGH-SPEED COAXIAL CONNECTOR; MILLIMETER WAVE PACKAGE DESIGN; RIBBON BONDS; SIGNAL PROCESSING CIRCUIT;

ELECTRONICS PACKAGING;

EID: 0035703980     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. FDTD analysis of high frequency electronic interconnection effects
2. An accurate equivalent circuit model of flip chip and via interconnects
3. A method for reduced-order modeling and simulation of large interconnect circuits and its application to PEEC models with retardation