Package model extraction from multi-port S-parameters

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2001, Pages 309-312

  Andrews, James A ^a   Kabir, Sutirtha ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; FREQUENCIES; MATHEMATICAL MODELS; OPTIMIZATION; PARAMETER ESTIMATION;

PACKAGE MODEL EXTRACTION; RAUTIOS METHOD;

ELECTRONICS PACKAGING;

EID: 0035699337     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Guideline for measurement of electronic package inductance and capacitance model parameters
2. High frequency limitations of JEDEC 123 guideline
3. A rigorous technique for measuring the scattering matrix of a multiport device with a 2-port network analyzer
4. Wide band 2N-port S-parameter extraction from N-port data
5. Synthesis of lumped models from n-port scattering parameter data
6. A circuit topology for microwave modeling of plastic surface mount packages
7. Microwave-circuit modeling of high lead-count plastic packages