Au-Sn microsoldering on flexible circuit

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 52-57

  Tjandra, Janto ^a   Wong, C L ^a   How, James ^a   Peana, Stefan ^a   Mita, Mamoru ^a   Murakami, Gen ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; GOLD ALLOYS; GOLD PLATING; INTEGRATED CIRCUIT MANUFACTURE; INTERMETALLICS; MICROELECTRONIC PROCESSING; PRINTED CIRCUIT MANUFACTURE; SOLDERING; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY;

CHIP ON FILM (COF) PACKAGES; FLEXIBLE CIRCUITS; MICROSOLDERING;

ELECTRONICS PACKAGING;

EID: 0031328520     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)