Development of CVD TiN(Si) for advance Cu barrier application

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 559-566

  Shahvandi, Iraj ^a   Brennan, Bill ^a   Prindle, Chris ^a   Denning, Dean ^a   Lii, Tom ^a   Iacoponi, John ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL VAPOR DEPOSITION; COPPER; CRYSTAL IMPURITIES; DIELECTRIC MATERIALS; ELECTRIC RESISTANCE; ELECTROPLATING; MORPHOLOGY; PHYSICAL VAPOR DEPOSITION; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; STOICHIOMETRY; SURFACE ROUGHNESS; TITANIUM COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY;

SHEET RESISTANCE;

SEMICONDUCTING FILMS;

EID: 0035555436     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)