Cu metallization issues in low κ SiOC integration

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 301-305

  Maitrejean, S ^a   Mourieir, T ^a   Morel, T ^a  

^a CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; METALLIZING; METALLORGANIC CHEMICAL VAPOR DEPOSITION; PERMITTIVITY; SECONDARY ION MASS SPECTROMETRY; SUBSTRATES; TITANIUM NITRIDE;

DIFFUSION BARRIERS;

DIELECTRIC MATERIALS;

EID: 0035555406     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)