The effect of Si dissolution on the stability of silica particles and its influence on chemical mechanical polishing for interlayer dielectrics

Journal of the Korean Physical Society

Volumn 39, Issue SUPPL. Part 1, 2001, Pages

  Pair, U ^a   Kim, J P ^a   Jung, Y S ^a   Jung, Y G ^b   Katoh, T ^a   Park, J G ^a   Hackley, V A ^c  

^a Hanyang University   (South Korea)

^b Changwon National University   (South Korea)

^c NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035542186     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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19. Certain trade names and company products are entioned in the text or identified in illustrations in order to specify adequately the experimental procedure and equipment used. In no case does such identification imply recommendation or endorsement by National Institute of Standards and Technology, nor does it imply that the products are necessarily the best available for the purpose.