Electrical characterization of a 500 MHz frequency EBGA package

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 4, 2001, Pages 534-541

  Hamano, Toshio ^a   Ikemoto, Yoshihiko ^b  

^a FUJITSU LABORATORIES OF AMERICA   (United States)

^b Advanced Packaging Technology R and D Department   (Japan)

Author keywords

Differential signal; EBGA; High clock frequency; High pin count; LVDS; Package; Parallel transmission

Indexed keywords

COMMON MODE NOISE; ELECTRICAL CHARACTERIZATION; ENHANCED BALL GRID ARRAY; FLIP CHIP BONDING; HIGH-CLOCK-FREQUENCY; PARALLEL TRANSMISSION PATH; SIGNAL INTEGRITY;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; COMPUTER SIMULATION; ELECTRIC IMPEDANCE; FLIP CHIP DEVICES; GOLD; LSI CIRCUITS; MICROSTRIP LINES; NICKEL; SPURIOUS SIGNAL NOISE; SUBSTRATES; TIME DOMAIN ANALYSIS; WAVEFORM ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0035521095     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.982841     Document Type: Article

References (3)

1. A 1.2 GHz alpha microprocessor with 44.8 GB/s chip pin bandwidth
2. Plastic LGA889 using flip-chip bonding on build-up substrate
3. 5Gb/s bidirectional balanced-line link compliant with plesiochronous clocking