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Volumn 24, Issue 4, 2001, Pages 576-585

Characterization of 63Sn37Pb and 80Au20Sn solder sealed optical fiber feedthroughs subjected to repetitive thermal cycling

(5) Beranek, M W a,b Rassaian, M b Tang, C H b St John, C L b Loebs, V A b

a IEEE (United States)

b BOEING COMPANY (United States)

Author keywords

63Sn37Pb; 80Au20Sn; FEM; Fiber optic; Helium leak; Hermetic feedthrough; Intermetallic; Kovar ; SEM EDX; Solder

Indexed keywords

HERMETIC FEEDTHROUGH; SOLDER JOINT FATIGUE; STRAIN ENERGY; THERMAL EFFECTIVE STRESS; THERMAL FATIGUE FRACTURE; THERMOELASTIC CREEP CONSTITUTIVE EQUATION;

CREEP; FATIGUE OF MATERIALS; FIBER OPTICS; FINITE ELEMENT METHOD; FRACTURE; GOLD ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN; THERMAL CYCLING; THERMOELASTICITY; TIN ALLOYS;

ELECTRONICS PACKAGING;

EID: 0035521092 PISSN: 15213323 EISSN: None Source Type: Journal
DOI: 10.1109/6040.982847 Document Type: Article

Times cited : (18)

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