EFFECTS OF SERVICE AND MATERIAL VARIABLES ON THE FATIGUE BEHAVIOR OF SOLDER JOINTS DURING THE THERMAL CYCLE.

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1985, Pages 46-51

  Stone, Donald ^a   Hannula, Simo Pekka ^a   Li, Che Yu ^a  

^a Department of Obstetrics Gynecology

Author keywords

[No Author keywords available]

Indexed keywords

STRESSES - THERMAL EFFECTS;

DAMAGE MECHANISM; SOLDER JOINT ASSEMBLY; STRESS-TIME PROFILE; THERMAL CYCLE;

SOLDERING;

EID: 0022240957     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)