Use of low cost plastic DIPs and injection molded parts in packaging of optical data links

Proceedings - Electronic Components Conference

Volumn , Issue , 1992, Pages 661-666

  Acarlar, M S ^a   Moyer, S L ^a   Robinson, S D ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FIBER OPTICS; INJECTION MOLDING; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED OPTICS; OPTICAL SYSTEMS; PLASTICS APPLICATIONS;

DATA LINKS; EMI SHIELDING; OPTICAL DATA LINKS; PLASTIC DIP;

OPTICAL LINKS;

EID: 0026711585     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)